conferencia sobre nuevas tecnologías en telecomunicación


Hoy se ha celebrado una conferencia en la ETS de Ingenieros Industriales y de Telecomunicación organizada por el Departamento de Ingeniería de Telecomunicaciones (DICOM) titulada “Design of Integrated RF-CMOS Circuits” impartida por el doctor Georg Böck del Laboratorio de Ingeniería de Microondas de la Universidad Técnica de Berlín. Desgraciadamente no he podido asistir.

La conferencia, que ha tratado del diseño de circuitos integrados de radiofrecuencia para telefonía móvil, ha abordado aspectos como los nuevos requisitos tecnológicos necesarios para transmitir voz, datos y multimedia con una elevada calidad, los diferentes estándares de transmisión existentes en la actualidad, las ventajas de la tecnología CMOS y las perspectivas de futuro.

2 comentarios en “conferencia sobre nuevas tecnologías en telecomunicación

  1. Parece que ayer se dio la misma conferencia en la Universidad Politécnica de Madrid, dentro de los seminarios del programa de doctorado en tecnologías y sistemas de telecomunicaciones. Aquí esta la referencia en inglés al evento:

    Design of RF-CMOS Integrated Circuits for Wireless Communications
    Georg Boeck (Berlin University of Technology )

    RESUMEN

    The continuous progress of silicon technology has enabled the emergence of digital mobile broadband communication systems for voice, data, multimedia and position with good quality of service. Different standards like 2G, 3G, Bluetooth, WLAN, GPS and digital multimedia broadcasting require multimode systems. Coexistence and inter-working of these different technologies as well as data-rate and mobility trade-offs are serious challenges to be solved. Single chip integration with digital part, high integration density and excellent RF-performance, low power consumption and low cost under mass production aspects are the key requirements. This presentation will review RF-CMOS technologies, RF-architectures and re-configurability principles as well as circuit and system design aspects for mobile multi-mode terminals. Wafer processes like leakage and electromagnetic interference will be considered. Power-levels, form factors and cost aspects for system-in-package and system-on-chip solutions will be discussed, too. As a conclusion it will be shown that today CMOS technologies seem to be able to fulfill most these requirements.

    DOCUMENTACIÓN

    Documentación no disponible

    Prof. Boeck received the doctoral degree from Berlin University of Technology, Berlin, Germany, in 1984. In the same year he joined Siemens Research Labs in Munich, Germany, where his research areas were on fiber optics and GaAs electronics. From 1988 to 1991, he was a Full Professor for electronic devices and circuits at the University of Applied Sciences Regensburg, Regensburg, Germany. Since 1991, he has been the head of the Microwave Engineering Lab at Berlin University of Technology. His main areas of research are characterization, modeling and design of microwave semiconductor devices, MICs, and MMICs up to the 100 GHz range. Prof. Boeck has authored or co-authored more than 170 technical papers and one book and holds several patents. He serves at several Technical Program Committees and is a member of the editorial board of the Journal of RF-Engineering and Telecommunications and an Associate Editor of IEEE Microwave and Wireless Components Letters. He is a Guest Professor of the Southeast University Nanjing, Nanjing, China and an international IEEE Distinguished Microwave Lecturer for the years 2006-2008 in the field of “Design of RF CMOS Integrated Circuits”.

  2. Dándole vueltas a la cabeza me he puesto a investigar por Internet para ver lo que podía sacar de la información proporcionada en el anuncio de la conferencia. En primer lugar me he pasado por la web del Laboratorio de Microondas de la Universidad Técnica de Berlin (Fachgebiet Mikrowellentechnik, Fakultät IV-Elektrotechnik und Informatik, Technische Universität Berlin) y he ido a la lista de publicaciones (Publikationen), encontrado una referencia a una publicación que tiene el mismo título que el de la conferencia:

    Design of RF-CMOS Integrated Circuits for Wireless Communications
    Mediterranean Microwave Symposium 2007 (MMS 2007), Budapest, Hungary, 14 – 16 May 2007, pp. 99 -104

    Georg Böck

    Haciendo una búsqueda por Google en busca de la publicación me he encontrado, por una parte con la referencia completa y abstract en el IEEE Xplore:

    RF-CMOS Integrated Circuits for Wireless Communications
    Bock, G.
    Tech. Univ. Berlin, Berlin;

    This paper appears in: Microwaves, Radar & Wireless Communications, 2006. MIKON 2006. International Conference on

    Publication Date: 22-24 May 2006
    On page(s): 1207-1214
    Location: Krakow,
    ISBN: 978-83-906662-8-0
    INSPEC Accession Number: 9700731
    Digital Object Identifier: 10.1109/MIKON.2006.4345405
    Date Published in Issue: 2007-10-15 09:34:04.0

    Abstract

    This paper reviews state of the art CMOS-RFICs for wireless transceivers. It discusses principles and trends in the development of wireless platforms in the context of CMOS technology evolution. Some examples of achievements and commercial implementations are presented. Finally, some perspectives on future directions in RF-CMOS integration will be given.

    Y un documento más extenso con el contenido de la publicación y una biografía del autor:

    Design of RF-CMOS Integrated Circuits for
    Wireless Communications
    Georg Boeck
    Berlin University of Technology, Microwave Engineering Lab, boeck@tu-berlin.de

    Abstract

    The continuous progress of silicon technology has enabled the emergence of digital mobile broadband communication systems for voice, data, multimedia and position with good quality of service. Different standards like 2G, 3G, Bluetooth, WLAN, GPS and digital multimedia broadcasting require multimode systems. Coexistence and inter-working of these different technologies as well as data-rate and mobility trade-offs are serious challenges to be solved.

    Single chip integration with digital part, high integration density and excellent RF-
    performance, low power consumption and low cost under mass production aspects are the key requirements.

    This presentation will review RF-CMOS technologies, RF-architectures and re-configurability principles as well as circuit and system design aspects for mobile multi-mode terminals.

    Wafer processes like leakage and electromagnetic interference will be considered. Power-levels, form factors and cost aspects for system-in-package and system-on-chip solutions will be discussed, too.

    As a conclusion it will be shown that today CMOS technologies seem to be able to fulfill most these requirements.

    Biography Georg Boeck

    Prof. Boeck received the doctoral degree from Berlin University of Technology, Berlin, Germany, in 1984. In the same year he joined Siemens Research Labs in Munich, Germany, where his research areas were on fiber optics and GaAs electronics.

    From 1988 to 1991, he was a Full Professor for electronic devices and circuits at the University of Applied Sciences Regensburg, Regensburg, Germany. Since 1991, he has been the head of the Microwave Engineering Lab at Berlin University of Technology. His main areas of research are characterization, modeling and design of microwave semiconductor devices, MICs, and MMICs up to the 100 GHz range.
    Prof. Boeck has authored or co-authored more than 170 technical papers and one book and holds several patents. He serves at several Technical Program Committees and is a member of the editorial board of the Journal of RF-Engineering and Telecommunications and an Associate Editor of IEEE Microwave and Wireless Components Letters.

    He is a Guest Professor of the Southeast University Nanjing, Nanjing, China and an
    international IEEE Distinguished Microwave Lecturer for the years 2006-2008 in the field of “Design of RF CMOS Integrated Circuits”.

    Prof. Dr.-Ing. Georg Boeck
    Berlin University of Technology Microwave Engineering Lab
    Sekr. HFT 5-1, Einsteinufer 25
    10587 Berlin
    Tel. 030/314-26895
    Fax 030/314-26893
    Email: boeck@tu-berlin.de
    WEB: www-mwt.ee.tu-berlin.de

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